Dynamic analysis of electronic components industry

The BB values of North American and Japanese semiconductor equipment manufacturers in April were 0.81 and 0.76, respectively

SEMI data shows that the North American semiconductor equipment manufacturer's order-to-shipment ratio based on the three-month moving average in April was 0.81, a decrease of 0.06 from March. Among them, the order value was US$1.074 billion, a decrease of 7.88% month-on-month and 31.50% year-on-year. Shipment value was US$1.319 billion, a decrease of 1.93% from the previous month and a year-on-year decrease of 17.30%.

SEAJ data show that the order-to-shipment ratio of Japanese semiconductor equipment manufacturers based on the three-month moving average in April was 0.76, an increase of 0.03 from March. Although the BB value rose slightly, orders and shipments both shrank. The order value was 104.75 billion yen, a decrease of 7.69% month-on-month and 35.37% year-on-year. Shipment volume was 137.32 billion yen, a decrease of 11.32% month-on-month and a year-on-year decrease of 20.22%. Global semiconductor manufacturers are still relatively bearish on future growth, and capital expenditures are conservative.

The sales revenue concentration of domestic IC packaging and testing companies in 2007 was C10 of 71.4%

The total revenue of the top 10 domestic IC packaging and testing companies in 2007 was 47.59 billion yuan, accounting for 71.4% of the total IC packaging and testing revenue that year, an increase of 2.4 percentage points from 69% in 2006, and the market concentration continued to increase.

Foreign-funded enterprises dominate the IC packaging and testing industry.

Among the top 10 IC packaging and testing companies, the only domestic-funded companies are Xinchao Technology and Huada Group. The joint ventures include Shanghai Matsushita Semiconductor and Shenzhen Saiyifa, and the remaining 6 are wholly foreign-owned enterprises. Among the top 10 IC packaging and testing companies, domestic and joint ventures have sales revenue of 12.695 billion yuan, accounting for 19% of industry sales revenue, and wholly foreign-owned enterprises have sales revenue of 34.895 billion yuan, accounting for 52.4% of industry sales revenue.

Foreign-funded enterprises are still the main force promoting the development of the domestic IC packaging and testing industry.

The number of companies with sales revenue exceeding 10 billion yuan in 2007 increased from one in 2006 to two, both of which are foreign-funded IDM-type companies. Freescale Semiconductor (China) Co., Ltd. has annual sales revenue of 13.463 billion yuan, a year-on-year increase of 24.1%, accounting for 20.2% of industry sales revenue. Qimonda Technology (Suzhou) Co., Ltd.'s sales revenue increased by 332.3% in 2006 and 45.5% in 2007. Sales revenue reached 10.033 billion yuan, accounting for 15.1% of industry sales revenue.

2007 global wireless semiconductor market sales revenue increased by 7.6%

iSuppli's data shows that in 2007 the global wireless semiconductor market sales revenue was 29.5 billion U.S. dollars, an increase of 7.6% from the 27.4 billion U.S. dollars in 2006. The sales revenue of wireless semiconductors includes the sales of semiconductors in wireless application equipment such as mobile phones, wireless infrastructure equipment, wireless local area networks and connection products.

　　Mobile phones promote wireless semiconductor sales growth faster than the semiconductor industry.

In 2007, the global semiconductor market sales revenue increased by 3.3% year-on-year, and the global mobile phone shipments during the same period were 1.15 billion units, a year-on-year increase of 16.1%. The growth of mobile phone shipments has driven the growth of wireless semiconductor sales.

The sales revenue of the six major wireless semiconductor manufacturers in 2007 all achieved double-digit growth. Qualcomm's sales revenue increased by 24.1%, and its market share increased from 16.5% in 2006 to 19.1%, ranking first in the global wireless semiconductor market. Texas Instruments' market share dropped from 19.4% in 2006 to 16.7%, ranking second.

STMicroelectronics' ranking has risen from fifth in 2006 to third. Infineon’s ranking has risen from eighth in 2006 to fourth.

Shanghai National Integrated Circuit R&D Center built a 12-inch pilot line

　　The civil construction project of the "12-inch/65-45nm" product pilot line built by the Shanghai National Integrated Circuit R&D Center invested 1.15 billion yuan, which indicates that China's first public platform for nanoscale IC process research and development will be formed in Shanghai.

The Shanghai National Integrated Circuit R&D Center is a non-profit established by Hua Hong Group, Shanghai Venture Capital, Shanghai Dasheng, Zhangjiang Group, Shanghai Belling, Shanghai Xintou, Fudan University, Shanghai Jiaotong University, East China Normal University and other universities. A public R&D platform. At present, in addition to the pilot line under construction, two sub-platforms are also operated in-line with mature production lines. Among them, the "special process platform" relies on the 6-inch product line provided by Shanghai Belling; and the "8-inch/130 to 90 nanometer/copper interconnection line" has won the international donation of a full set of production equipment, which runs in the Hua Hong NEC plant.

The Shanghai National Integrated Circuit R&D Center is currently building patent pools with a number of companies and universities. The members of the Enterprise R&D Alliance have shared 2,000 patents to dilute the rising cost of process R&D and create opportunities to exchange patents with foreign countries. Some small and medium-sized IC design companies can stream chips in small batches on the pilot line, and some semiconductor materials and equipment developed by local companies will also be trial-produced here. It is reported that the cost of research and development of MEMS infrared detection chips between the center and a company in Zhejiang is only 1/10 of that of similar foreign products.

NAND flash memory shipments in the first quarter increased by 30% year-on-year, revenue fell by 15.8% year-on-year

Due to the in-depth development of the subprime mortgage crisis and the negative impact of the industry's off-season on demand, the oversupply of NAND flash memory in the first quarter did not improve. Although NAND flash memory manufacturers’ shipments in the first quarter increased by 30% year-on-year, as the average price of NAND flash memory fell 35% from the previous month, revenue fell 15.8% year-on-year to US$3.24 billion.

The top five manufacturers of NAND flash memory revenue in the first quarter were Samsung, Toshiba, Hynix, Micron, and Intel. The top five brand manufacturers had a total market share of 96.8%.

　　Samsung's market share of NAND flash memory revenue in the first quarter was 39.6%, down from the fourth quarter of last year, but still ranked first. Although the proportion of new 51nm process products has increased significantly, due to the sharp drop in the price of NAND flash memory, revenue in the first quarter fell 18.7% from the fourth quarter of last year to 1.28 billion U.S. dollars.

Toshiba's NAND flash memory revenue market share in the first quarter was 26.4%, ranking second. Due to the smooth output of Toshiba's 56nm process and the significant increase in the proportion of shipments, the impact of the sharp drop in the price of NAND flash memory was offset, making the first quarter revenue the same as the fourth quarter of last year, at 855 million US dollars.

　　The third-ranked Hynix had a 17.5% market share of NAND flash memory revenue in the first quarter. As Hynix reduced the output of NAND flash memory, the quarterly growth rate of shipments in the first quarter was 9%. However, due to the sharp drop in the average price of NAND flash memory, revenue in the first quarter fell by 29.1% compared with the fourth quarter of last year. , Is 569 million US dollars.

　　Micron and Intel continued to grow their shipments steadily in the first quarter as the proportion of 50nm process output increased. The fall in the price of NAND flash memory caused its revenue in the first quarter to fall from the previous quarter. Micron and Intel's revenue in the first quarter reached US$248 million and US$181 million, with market share of 7.7% and 5.6%, respectively.